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What is thermal resistance of each package?

Latest Updated:03/25/2009

Question:

What is thermal resistance of each package?

Answer:

θja, the junction to case thermal resistance(not mounted on board), θja, the junction to ambient thermal resistance(mounted on board), and the junction to case thermal resistance, of each package are as follows. As thermal resistance varies depending on the lead frame material and die size, the data must be handled taking the test conditions into consideration.

Please refer to the package data book

Package code
θja(℃/W)
Not mounted on board
θja(℃/W)
Mounted on board
MP-26DT
125
78
FP-44A
121
102
FP-64
111
87
FP-64A
118
103
FP-64H
94
60
FP-80
98
88
FP-80A
115
99
FP-80Q
94
58
FP-100
97
88
FP-100B
107
80
FP-100M
99
58
FP-100M
86
47
FP-112
82
-
FP-112B
74
54
FP-128
93
63
FP-136
88
73
FP-144G
65
45
FP-144G
57
37
FP-144J
100
64
FP-144J
75
45

In addition, RENESAS does not guarantee these parameters. Please use these values only for your reference.
Suitable Products
H8/300H Tiny
H8/36109
H8/36087
H8/36077, H8/36079
H8/36064
H8/36049
H8/36037, H8/36057
H8/36014, H8/36024
H8/3694
H8/3687
H8/3672
H8/3664
H8/36912, H8/36902